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| ENQ: |
Industrial & Specialty Chemicals Div. |
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| 25-10 Hatchobori, 2chome, Chuo-ku, Tokyo 104-8502, JAPAN
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| TEL 03-3552-9371 FAX 03-5566-8395 |
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| E-mail newprod@chemiway.co.jp
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| Bis-allyl-nadi-imide (BANI) |
| BANI is a type of thermosetting imide resins. Before thermally set, BANI has
characteristics, such as high solubility in many universal solvents and excellent
compatibility with many resins, including an epoxy one. After thermally set, moreover,
BANI shows high thermal resistance at a glass transition point of 300°C or
more. |
| |
BANI-M |
BANI-X |
| CAS No. |
91865-54-2 |
165407-21-6 |
| Stractual Formula |
|
|
R=
 |
R=
 |
*BANI-M was registered as ENCS on Ministry of Health & Welfare
(Environmental Health Bureau Office of Environmental Chemical Safty) in 1997.
|
TEST
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TYPICAL ANALYSIS
|
TEST
|
| BANI-M |
BANI-X |
Monomer
Physicality |
Appearance |
|
Brown
Solid
|
Light
Yellow Solid
|
|
| Melting Point |
°C |
75
|
40
|
|
Specific Gravity
(23/23°C) |
|
1.128
|
1.1213
|
JIS-K-7232 |
Curing
condition
(250°C×24h) |
Flexural Strenght |
MPa |
120
|
140
|
JIS-K-7203 |
Tg (Glass
Transition
Temperature) |
°C |
339
|
308
|
TMA |
Refractory 5%
Weight Reduction
Temperature |
°C |
440
|
437
|
TGA |
Coefficient of
Thermal Expansion
(25°C~Tg) |
/°C |
5.15×10-5
|
4.83×10-5
|
TMA |
Water Absorption
Rate |
wt% |
1.1
|
0.75
|
JIS-K-7209 |
| |
Dielectric Constant
(1MHz) at 25°C
at 250°C
(1KHz) at 25°C |
3.0
2.8
3.27 |
3.09
2.89
3.18 |
MIL-P-55617 |
| As shown in Table 2, BANI before thermally set is soluble in almost all organic
solvents, except for aliphatic alcohol and aliphatic hydrogen carbide. Such excellent
solubility permits you to select an appropriate solvent for BANI according to
your application. |
Table 2
|
Solvent
|
Resin
|
|
BANI-M
|
BANI-X
|
| Methanol |
|
|
| Methyl ethyl ketone(MEK) |
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| Toluene |
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| Xylene |
|
|
| Dimethyl formamide(DMF) |
|
|
 : soluble,
 : partially soluble,
 : insoluble, At
room tempreture, 40wt% |
| BANI is a monomer type imide resin of low molecular weight. It shows a high
level of compatibility, therefore, with a variety of resins. And it may be mixed
in a wide range of composition. |
| * |
The resins compatible with BANI are as enumerated below.
Phenol resin, epoxy resin, silicone resin, fluoric resin, thermoplastic polyamide,
etc.
All of these resins may be modified, denatured and otherwise treated by making
effective use of BANI's characteristics. |
| As shown in Table 3, the BANI once thermally set shows excellent resistance
to many chemicals. |
Table 3
|
Resin
|
Curing Conditions
|
Agent
|
|
Sulfuric
acid
20wt%
|
NaOH
Aqueous
solution
20wt%
|
Methanol
|
Xylene
|
MEK
|
DMF
|
Kerosene
|
| BANI-M |
250°C * 24h |
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| Test Condition |
Test Specimen |
50mm * 50mm * 40mm |
|
Test Method |
Maceration at room temprature |
|
Test Period |
7 days |
| MAJOR USE: |
Modification for resins, Heat-stable Paint, Heat-stable adhesive
Impregnated Resin, Cast material |
| NOTE) |
Bis-allyl-nadi-imide (BANI) is a new thermosetting imide resin, which we
have commercialized in a technical cooperation with Ciba-Geigy. Our agreement
with Ciba-Geigy prohibits this product (except for BANI-X) from being used as
a composite in aeronautical, space, military and express-train applications under.
This is requested to be noted, therefore, whenever you may use our BANI product.
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