BANI（Bis-allyl nadi imide）

BANI is a type of thermosetting imide resins. Before curing, BANI has high solubility in many organic solvents and excellent compatibility with many resins including an epoxy one. After thermosseting, BANI has the high heat resistance which Tg is over 300C.

	▼ Molecular Formula	▼ CAS No.	▼ Structural Formula
BANI-M	C₃₇H₃₄N₂O₄	91865-54-2	Ｒ＝
BANI-X	C₃₂H₃₂N₂O₄	165407-21-6	Ｒ＝

TYPICAL PROPERTIES

▼ Test Items		▼ UNIT	▼ Typical Properties		▼ TEST METHOD
▼ Test Items		▼ UNIT	BANI-M	BANI-X	▼ TEST METHOD
As a Monomer	Appearance	－	Brown Powder	Yellowish brown Powder	as visual
	Melting Point	℃	75	40
	Specific Grabity（23/23℃）		1.128	1.213	JIS K 7232
A PROPERTIES AFTER CURING 　(Curing condition :250℃×24hr)	Flexural Strenght	mPa	120	140	JIS K 7203
	Tg(Glass Transition Temperature)	℃	339	308	TMA
	Refractory 5% Weight Reduction Temperature	℃	440	437	TGA
	Coefficient of Thermal Expansion (25℃~Tg)	/℃	5.15×10^-5	4.83×10^-5	TMA
	Water Absorption Rate	wt％	1.1	0.75	JIS K 7209
	Dielectric Constant	1MHz at 25℃	3.0	3.09	MIL-P-55617
		1MHz at 250℃	2.8	2.89
		1kHz at 25℃	3.27	3.18

Table 2. Solubility of BANI for typical organic solvent

As shown in Table 2, BANI before curing is soluble in almost typical organic solvents except for aliphatic alcohol and aliphatic hydrocarbon. Such excellent solubility can be able to select an appropriate solvent for BANI according to the application.

Table 2. Solubility of BANI for typical organic solvent

▼ Solvent	▼ Resin
▼ Solvent	BANI-M	BANI-X
Methyl alcohol	×	△
2-Butanone(Methyetylketone, MEK)	○	○
Toluene	○	○
Xylene	○	○
Dimethylformamide(DMF)	○	○

○：soluble，　△：partially soluble，　×：insoluble，　Concentration:40wt% at Room Temperature

COMPATIBILITY

BANI shows a high level of compatibility and wide range of mixing ratio with many kinds of resins* due to the lower molecular type of imide resin. BANI's character can easily achive the modification and/or denaturation of resins. *Phenol resin, epoxy resin, silicone resin, fluoric resin, thermoplastic polyamide, etc.

CHEMICAL RESISTANCE AFTER CURING

As shown in Table 3, BANI shows the excellent chemical resistance after curing.

Table 3

	▼ Agent
	20wt% Sulfuric acid	20wt%NaOH aquenous solution	Methyl alcohol	Xylene	MEK	DMF	Kerosene
BANI-M	○	○	○	○	○	○	○

［ Curing Condition ］250℃×24hr

［ Test Condition ］Test Specimen: 50mm * 50mm * 40mm
Test Method: Maceration at room temprature
Test Period: 7 days

Mejor use

Modification agent for resins, Heat-stable Paint, Heat-stable adhesive Impregnated Resin, Cast material

Note

The descriptions herein are based on the available sources and information but no guarantee is given for its integrity of accuracy

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